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Techniques for the Control of Integrated Circuit Quality and Reliability Volume Ii - Appendices

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Release : 1967
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Book Synopsis Techniques for the Control of Integrated Circuit Quality and Reliability Volume Ii - Appendices by : Erwin A. Herr

Download or read book Techniques for the Control of Integrated Circuit Quality and Reliability Volume Ii - Appendices written by Erwin A. Herr. This book was released on 1967. Available in PDF, EPUB and Kindle. Book excerpt: This is a program directed to establish techniques for the control of integrated circuit quality and reliability. The primary objective of this program was to investigate a method to monitor integrated circuit fabrication which would provide information about the quality and reliability of the device. The use of the test pattern concept, TEG, for in-process quality control and device reliability of integrated circuits was investigated during the fabrication and reliability testing phases of integrated circuit production. The Test Element Group (TEG), which was diffused on the wafer at the same time as the elements of the integrated circuit, proved to be a very successful vehicle for achieving the goals of this program. The TEG was made up of a number of selected elements in the integrated circuit diffusion pattern, metallized and connected for test evaluation as discrete components. The relationship was investigated between in-process variables of semiconductor fabrication, pre-stress characteristics of TEGS and integrated circuits and the post-stress characteristics of TEGS and integrated circuits.

Techniques for the Control of Integrated Circuit Quality and Reliability

Download Techniques for the Control of Integrated Circuit Quality and Reliability PDF Online Free

Author :
Release : 1967
Genre :
Kind : eBook
Book Rating : /5 ( reviews)

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Book Synopsis Techniques for the Control of Integrated Circuit Quality and Reliability by : Erwin A. Herr

Download or read book Techniques for the Control of Integrated Circuit Quality and Reliability written by Erwin A. Herr. This book was released on 1967. Available in PDF, EPUB and Kindle. Book excerpt: The use of the test pattern concept, TEG, for in-process quality control and device reliability of integrated circuits was investigated during the fabrication and reliability testing phases of integrated circuit production. The Test Element Group (TEG), which was diffused on the wafer at the same time as the elements of the integrated circuit, proved to be a very successful vehicle for achieving the goals of this program. The TEG was made up of a number of selected elements in the integrated circuit diffusion pattern, metallized and connected for test evaluation as discrete components. The relationship was investigated between in-process variables of semi-conductor fabrication, pre-stress characteristics of TEGS and integrated circuits and the post-stress characteristics of TEGS and integrated circuits. The basic purpose of this program has been met.

Integrated Circuit Quality and Reliability

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Author :
Release : 1987
Genre : Technology & Engineering
Kind : eBook
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Book Synopsis Integrated Circuit Quality and Reliability by : Eugene R. Hnatek

Download or read book Integrated Circuit Quality and Reliability written by Eugene R. Hnatek. This book was released on 1987. Available in PDF, EPUB and Kindle. Book excerpt: Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

Handbook of Quality Integrated Circuit Manufacturing

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Author :
Release : 2012-12-02
Genre : Technology & Engineering
Kind : eBook
Book Rating : 556/5 ( reviews)

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Book Synopsis Handbook of Quality Integrated Circuit Manufacturing by : Robert Zorich

Download or read book Handbook of Quality Integrated Circuit Manufacturing written by Robert Zorich. This book was released on 2012-12-02. Available in PDF, EPUB and Kindle. Book excerpt: Here is a comprehensive practical guide to entire wafer fabrication process from A to Z. Written by a practicing process engineer with years of experience, this book provides a thorough introduction to the complex field of IC manufacturing, including wafer area layout and design, yield optimization, just-in-time management systems, statistical quality control, fabrication equipment and its setup, and cleanroom techniques. In addition, it contains a wealth of information on common process problems: How to detect them, how to confirm them, and how to solve them. Whether you are a new enginner or technician just entering the field, a fabrication manager looking for ways to improve quality and production, or someone who would just like to know more about IC manufacturing, this is the book you're looking for. Provides a readable, practical overview of the entire wafer fabrication process for new engineers and those just entering this complex field Enables engineers and managers to improve production, raise quality levels, and solve problems that commonly occur in the fabrication process Presents the latest techniques and gives special attention to Japanese IC manufacturing techniques, showing how they obtain outstanding quality

Integrated Circuit Quality and Reliability

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Author :
Release : 2018-10-03
Genre : Technology & Engineering
Kind : eBook
Book Rating : 719/5 ( reviews)

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Book Synopsis Integrated Circuit Quality and Reliability by : Eugene R. Hnatek

Download or read book Integrated Circuit Quality and Reliability written by Eugene R. Hnatek. This book was released on 2018-10-03. Available in PDF, EPUB and Kindle. Book excerpt: Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

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