1# Library to Find Best eBook for Read
Author : Fan Wu
Release : 2021
Genre :
Kind : eBook
Book Rating : /5 ( reviews)
Book Synopsis System Design and Fabrication Using Monolithic 3D Integration of Heterogeneous Technologies by : Fan Wu
Download or read book System Design and Fabrication Using Monolithic 3D Integration of Heterogeneous Technologies written by Fan Wu. This book was released on 2021. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Tony Fan Wu
Release : 2021
Genre : Heterogeneous computing
Kind : eBook
Book Rating : /5 ( reviews)
Book Synopsis System Design and Fabrication Using Monolithic 3d Integration of Heterogeneous Technologies by : Tony Fan Wu
Download or read book System Design and Fabrication Using Monolithic 3d Integration of Heterogeneous Technologies written by Tony Fan Wu. This book was released on 2021. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Katsuyuki Sakuma
Release : 2018-04-17
Genre : Technology & Engineering
Kind : eBook
Book Rating : 834/5 ( reviews)
Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma
Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma. This book was released on 2018-04-17. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Author : Antonis Papanikolaou
Release : 2010-12-07
Genre : Architecture
Kind : eBook
Book Rating : 621/5 ( reviews)
Book Synopsis Three Dimensional System Integration by : Antonis Papanikolaou
Download or read book Three Dimensional System Integration written by Antonis Papanikolaou. This book was released on 2010-12-07. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Author : Chuan Seng Tan
Release : 2009-06-29
Genre : Technology & Engineering
Kind : eBook
Book Rating : 344/5 ( reviews)
Book Synopsis Wafer Level 3-D ICs Process Technology by : Chuan Seng Tan
Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan. This book was released on 2009-06-29. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
