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3D Integration in VLSI Circuits

2018-04-17 Technology & Engineering
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Release : 2018-04-17
Genre : Technology & Engineering
Kind : eBook
Book Rating : 834/5 ( reviews)

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Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma. This book was released on 2018-04-17. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

3D Integration in VLSI Circuits

2018-04-17 Technology & Engineering
Download 3D Integration in VLSI Circuits PDF Online Free

Author :
Release : 2018-04-17
Genre : Technology & Engineering
Kind : eBook
Book Rating : 826/5 ( reviews)

GET EBOOK


Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma. This book was released on 2018-04-17. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

3D Integration for VLSI Systems

2016-04-19 Science
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Release : 2016-04-19
Genre : Science
Kind : eBook
Book Rating : 828/5 ( reviews)

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Book Synopsis 3D Integration for VLSI Systems by : Chuan Seng Tan

Download or read book 3D Integration for VLSI Systems written by Chuan Seng Tan. This book was released on 2016-04-19. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Handbook of 3D Integration, Volume 1

2011-09-22 Technology & Engineering
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Release : 2011-09-22
Genre : Technology & Engineering
Kind : eBook
Book Rating : 06X/5 ( reviews)

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Book Synopsis Handbook of 3D Integration, Volume 1 by : Philip Garrou

Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou. This book was released on 2011-09-22. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

3D Integration in VLSI Circuits

2018 Computers
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Release : 2018
Genre : Computers
Kind : eBook
Book Rating : 699/5 ( reviews)

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Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma. This book was released on 2018. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

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