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Chemical Mechanical Planarization in IC Device Manufacturing III

2000 Technology & Engineering
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Release : 2000
Genre : Technology & Engineering
Kind : eBook
Book Rating : 600/5 ( reviews)

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Book Synopsis Chemical Mechanical Planarization in IC Device Manufacturing III by : Robert Leon Opila

Download or read book Chemical Mechanical Planarization in IC Device Manufacturing III written by Robert Leon Opila. This book was released on 2000. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

2013-03-09 Science
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Release : 2013-03-09
Genre : Science
Kind : eBook
Book Rating : 283/5 ( reviews)

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Book Synopsis Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication by : Jianfeng Luo

Download or read book Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication written by Jianfeng Luo. This book was released on 2013-03-09. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.

Microelectronic Applications of Chemical Mechanical Planarization

2007-12-04 Technology & Engineering
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Release : 2007-12-04
Genre : Technology & Engineering
Kind : eBook
Book Rating : 891/5 ( reviews)

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Book Synopsis Microelectronic Applications of Chemical Mechanical Planarization by : Yuzhuo Li

Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li. This book was released on 2007-12-04. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

2014-03-12 Science
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Release : 2014-03-12
Genre : Science
Kind : eBook
Book Rating : 294/5 ( reviews)

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Book Synopsis Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication by : Jianfeng Luo

Download or read book Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication written by Jianfeng Luo. This book was released on 2014-03-12. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.

Chemical-Mechanical Planarization of Semiconductor Materials

2013-03-14 Technology & Engineering
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Release : 2013-03-14
Genre : Technology & Engineering
Kind : eBook
Book Rating : 348/5 ( reviews)

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Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver

Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver. This book was released on 2013-03-14. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

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