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VLSI FABRICATION PRINCIPLES: SILICON AND GALLIUM ARSENIDE, 2ND ED

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Release : 2008-08
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Kind : eBook
Book Rating : 909/5 ( reviews)

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Book Synopsis VLSI FABRICATION PRINCIPLES: SILICON AND GALLIUM ARSENIDE, 2ND ED by : Sorab K Ghandhi

Download or read book VLSI FABRICATION PRINCIPLES: SILICON AND GALLIUM ARSENIDE, 2ND ED written by Sorab K Ghandhi. This book was released on 2008-08. Available in PDF, EPUB and Kindle. Book excerpt: About The Book: Fully updated with the latest technologies, this edition covers the fundamental principles underlying fabrication processes for semiconductor devices along with integrated circuits made from silicon and gallium arsenide. Stresses fabrication criteria for such circuits as CMOS, bipolar, MOS, FET, etc. These diverse technologies are introduced separately and then consolidated into complete circuits.

VLSI Fabrication Principles

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Author :
Release : 1994-03-28
Genre : Technology & Engineering
Kind : eBook
Book Rating : /5 ( reviews)

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Book Synopsis VLSI Fabrication Principles by : Sorab Khushro Ghandhi

Download or read book VLSI Fabrication Principles written by Sorab Khushro Ghandhi. This book was released on 1994-03-28. Available in PDF, EPUB and Kindle. Book excerpt: In some places, the order of presentation has been changed to fine-tune the book's effectiveness as a senior and graduate-level teaching text. Fabrication principles covered include those for such circuits as CMOS, BIPOLAR, BICMOS, FET, and more.

VLSI Fabrication Principles

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Author :
Release : 1994-03-31
Genre : Technology & Engineering
Kind : eBook
Book Rating : 058/5 ( reviews)

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Book Synopsis VLSI Fabrication Principles by : Sorab K. Ghandhi

Download or read book VLSI Fabrication Principles written by Sorab K. Ghandhi. This book was released on 1994-03-31. Available in PDF, EPUB and Kindle. Book excerpt: Fully updated with the latest technologies, this edition covers thefundamental principles underlying fabrication processes forsemiconductor devices along with integrated circuits made fromsilicon and gallium arsenide. Stresses fabrication criteria forsuch circuits as CMOS, bipolar, MOS, FET, etc. These diversetechnologies are introduced separately and then consolidated intocomplete circuits. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment.

VLSI Fabrication Principles: Silicon And Gallium Arsenide, Second Edition Solutions Manual

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Release : 1995-10-12
Genre : Technology & Engineering
Kind : eBook
Book Rating : 564/5 ( reviews)

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Book Synopsis VLSI Fabrication Principles: Silicon And Gallium Arsenide, Second Edition Solutions Manual by : I. Bhat

Download or read book VLSI Fabrication Principles: Silicon And Gallium Arsenide, Second Edition Solutions Manual written by I. Bhat. This book was released on 1995-10-12. Available in PDF, EPUB and Kindle. Book excerpt:

Microelectronic Materials and Processes

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Release : 2012-12-06
Genre : Technology & Engineering
Kind : eBook
Book Rating : 179/5 ( reviews)

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Book Synopsis Microelectronic Materials and Processes by : R.A. Levy

Download or read book Microelectronic Materials and Processes written by R.A. Levy. This book was released on 2012-12-06. Available in PDF, EPUB and Kindle. Book excerpt: The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.

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