Author :
Release :
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Kind : eBook
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Book Synopsis MonolithIC 3D-ICs by :
Download or read book MonolithIC 3D-ICs written by . This book was released on . Available in PDF, EPUB and Kindle. Book excerpt:
Wafer Level 3-D ICs Process Technology
Author : Chuan Seng Tan
Release : 2009-06-29
Genre : Technology & Engineering
Kind : eBook
Book Rating : 344/5 ( reviews)
Book Synopsis Wafer Level 3-D ICs Process Technology by : Chuan Seng Tan
Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan. This book was released on 2009-06-29. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Handbook of 3D Integration, Volume 4
Author : Paul D. Franzon
Release : 2019-01-25
Genre : Technology & Engineering
Kind : eBook
Book Rating : 063/5 ( reviews)
Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon. This book was released on 2019-01-25. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
On the Design Partitioning of 3D Monolithic Circuits
Author : Luke Maresca
Release : 2012
Genre : Integrated circuits
Kind : eBook
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Book Synopsis On the Design Partitioning of 3D Monolithic Circuits by : Luke Maresca
Download or read book On the Design Partitioning of 3D Monolithic Circuits written by Luke Maresca. This book was released on 2012. Available in PDF, EPUB and Kindle. Book excerpt: "Conventional three-dimensional integrated circuits (3D ICs) stack multiple dies vertically for higher integration density, shorter wirelength, smaller footprint, faster speed and lower power consumption. Due to the large through-silicon-via (TSV) sizes, 3D design partitioning is typically done at the architecture-level With the emerging monolithic 3D technology, TSVs can be made much smaller, which enables potential block-level partitioning. However, it is still unclear how much benefit can be obtained by block-level partitioning, which is affected by the number of tiers and the sizes of TSVs. In this thesis, an 8-bit ripple carry adder was used as an example to explore the impact of TSV size and tier number on various tradeoffs between power, delay, footprint and noise. With TSMC 0.18um technology, the study indicates that when the TSV size is below 100nm, it can be beneficial to perform block-level partitioning for smaller footprint with minimum power, delay and noise overhead"--Abstract, leaf iii.
Physical Design for 3D Integrated Circuits
Author : Aida Todri-Sanial
Release : 2017-12-19
Genre : Technology & Engineering
Kind : eBook
Book Rating : 198/5 ( reviews)
Book Synopsis Physical Design for 3D Integrated Circuits by : Aida Todri-Sanial
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial. This book was released on 2017-12-19. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
