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Author : National Research Council
Release : 1990-02-01
Genre : Technology & Engineering
Kind : eBook
Book Rating : 33X/5 ( reviews)
Book Synopsis Materials for High-Density Electronic Packaging and Interconnection by : National Research Council
Download or read book Materials for High-Density Electronic Packaging and Interconnection written by National Research Council. This book was released on 1990-02-01. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Wendker Fassaden-Systembau GmbH
Release : 2001
Genre :
Kind : eBook
Book Rating : /5 ( reviews)
Book Synopsis Fertigfassaden & Fassaden-Systembau by : Wendker Fassaden-Systembau GmbH
Download or read book Fertigfassaden & Fassaden-Systembau written by Wendker Fassaden-Systembau GmbH. This book was released on 2001. Available in PDF, EPUB and Kindle. Book excerpt:
Author : National Aeronautics and Space Administration (NASA)
Release : 2018-07-18
Genre :
Kind : eBook
Book Rating : 131/5 ( reviews)
Book Synopsis Materials for High-Density Electronic Packaging and Interconnection by : National Aeronautics and Space Administration (NASA)
Download or read book Materials for High-Density Electronic Packaging and Interconnection written by National Aeronautics and Space Administration (NASA). This book was released on 2018-07-18. Available in PDF, EPUB and Kindle. Book excerpt: Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production. Unspecified Center COMPATIBILITY; ELECTRONIC PACKAGING; SEMICONDUCTORS (MATERIALS); INDUSTRIES; LEADERSHIP; MARKETING...
Author : National Research Council
Release : 1990-02-01
Genre : Technology & Engineering
Kind : eBook
Book Rating : 338/5 ( reviews)
Book Synopsis Materials for High-Density Electronic Packaging and Interconnection by : National Research Council
Download or read book Materials for High-Density Electronic Packaging and Interconnection written by National Research Council. This book was released on 1990-02-01. Available in PDF, EPUB and Kindle. Book excerpt:
Author : NATIONAL MATERIALS ADVISORY BOARD (NAS-NAE) WASHINGTON DC.
Release : 1990
Genre :
Kind : eBook
Book Rating : /5 ( reviews)
Book Synopsis Materials for High-Density Electronic Packaging and Interconnection by : NATIONAL MATERIALS ADVISORY BOARD (NAS-NAE) WASHINGTON DC.
Download or read book Materials for High-Density Electronic Packaging and Interconnection written by NATIONAL MATERIALS ADVISORY BOARD (NAS-NAE) WASHINGTON DC.. This book was released on 1990. Available in PDF, EPUB and Kindle. Book excerpt: Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production. (rh).
