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Electronic Packaging and Interconnection Handbook 4/E

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Release : 2005
Genre : Technology & Engineering
Kind : eBook
Book Rating : 487/5 ( reviews)

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Book Synopsis Electronic Packaging and Interconnection Handbook 4/E by : Charles A. Harper

Download or read book Electronic Packaging and Interconnection Handbook 4/E written by Charles A. Harper. This book was released on 2005. Available in PDF, EPUB and Kindle. Book excerpt: Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?

Handbook of Electronic Packaging

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Author :
Release : 1969
Genre : Technology & Engineering
Kind : eBook
Book Rating : /5 ( reviews)

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Book Synopsis Handbook of Electronic Packaging by : Charles A. Harper

Download or read book Handbook of Electronic Packaging written by Charles A. Harper. This book was released on 1969. Available in PDF, EPUB and Kindle. Book excerpt:

The Electronic Packaging Handbook

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Author :
Release : 2017-12-19
Genre : Technology & Engineering
Kind : eBook
Book Rating : 844/5 ( reviews)

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Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell

Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell. This book was released on 2017-12-19. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Electronic Packaging and Interconnection Handbook

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Author :
Release : 1997
Genre : Technology & Engineering
Kind : eBook
Book Rating : /5 ( reviews)

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Book Synopsis Electronic Packaging and Interconnection Handbook by : Charles A. Harper

Download or read book Electronic Packaging and Interconnection Handbook written by Charles A. Harper. This book was released on 1997. Available in PDF, EPUB and Kindle. Book excerpt: Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field

Electronic Packaging

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Author :
Release : 1998
Genre : Electronic packaging
Kind : eBook
Book Rating : 354/5 ( reviews)

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Book Synopsis Electronic Packaging by : John H. Lau

Download or read book Electronic Packaging written by John H. Lau. This book was released on 1998. Available in PDF, EPUB and Kindle. Book excerpt: Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

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