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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

2019-01-29 Technology & Engineering
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Release : 2019-01-29
Genre : Technology & Engineering
Kind : eBook
Book Rating : 562/5 ( reviews)

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Book Synopsis Die-Attach Materials for High Temperature Applications in Microelectronics Packaging by : Kim S. Siow

Download or read book Die-Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow. This book was released on 2019-01-29. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Evaluation of Die Attach Materials for High Temperature Power Electronics Applications and Analysis of the Ag Particles Sintering Solution

2015
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Release : 2015
Genre :
Kind : eBook
Book Rating : 164/5 ( reviews)

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Book Synopsis Evaluation of Die Attach Materials for High Temperature Power Electronics Applications and Analysis of the Ag Particles Sintering Solution by : Luis Alberto Navarro Melchor

Download or read book Evaluation of Die Attach Materials for High Temperature Power Electronics Applications and Analysis of the Ag Particles Sintering Solution written by Luis Alberto Navarro Melchor. This book was released on 2015. Available in PDF, EPUB and Kindle. Book excerpt: Sintering of Ag particles is an interesting solution as die-attach material for power electronics packaging in high temperature applications because it offers the outstanding properties of Ag (including a 961 oC melting point) using low process temperature (

Harsh Environment Electronics

2019-08-05 Technology & Engineering
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Release : 2019-08-05
Genre : Technology & Engineering
Kind : eBook
Book Rating : 195/5 ( reviews)

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Book Synopsis Harsh Environment Electronics by : Ahmed Sharif

Download or read book Harsh Environment Electronics written by Ahmed Sharif. This book was released on 2019-08-05. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Organic and Inorganic Light Emitting Diodes

2023-06-19 Science
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Release : 2023-06-19
Genre : Science
Kind : eBook
Book Rating : 807/5 ( reviews)

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Book Synopsis Organic and Inorganic Light Emitting Diodes by : T.D. Subash

Download or read book Organic and Inorganic Light Emitting Diodes written by T.D. Subash. This book was released on 2023-06-19. Available in PDF, EPUB and Kindle. Book excerpt: This book covers a comprehensive range of topics on the physical mechanisms of LEDs (light emitting diodes), scattering effects, challenges in fabrication and efficient enhancement techniques in organic and inorganic LEDs. It deals with various reliability issues in organic/inorganic LEDs like trapping and scattering effects, packaging failures, efficiency droops, irradiation effects, thermal degradation mechanisms, and thermal degradation processes. Features: Provides insights into the improvement of performance and reliability of LEDs Highlights the optical power improvement mechanisms in LEDs Covers the challenges in fabrication and packaging of LEDs Discusses pertinent failures and degradation mechanisms Includes droop minimization techniques This book is aimed at researchers and graduate students in LEDs, illumination engineering, optoelectronics, and polymer/organic materials.

Harsh Environment Electronics

2019-04-09 Technology & Engineering
Download Harsh Environment Electronics PDF Online Free

Author :
Release : 2019-04-09
Genre : Technology & Engineering
Kind : eBook
Book Rating : 977/5 ( reviews)

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Book Synopsis Harsh Environment Electronics by : Ahmed Sharif

Download or read book Harsh Environment Electronics written by Ahmed Sharif. This book was released on 2019-04-09. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

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