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Compact Models and Measurement Techniques for High-Speed Interconnects

2012-02-17 Technology & Engineering
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Release : 2012-02-17
Genre : Technology & Engineering
Kind : eBook
Book Rating : 703/5 ( reviews)

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Book Synopsis Compact Models and Measurement Techniques for High-Speed Interconnects by : Rohit Sharma

Download or read book Compact Models and Measurement Techniques for High-Speed Interconnects written by Rohit Sharma. This book was released on 2012-02-17. Available in PDF, EPUB and Kindle. Book excerpt: Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.

Compact Models and Measurement Techniques for High-Speed Interconnects

2012-02-17 Technology & Engineering
Download Compact Models and Measurement Techniques for High-Speed Interconnects PDF Online Free

Author :
Release : 2012-02-17
Genre : Technology & Engineering
Kind : eBook
Book Rating : 711/5 ( reviews)

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Book Synopsis Compact Models and Measurement Techniques for High-Speed Interconnects by : Rohit Sharma

Download or read book Compact Models and Measurement Techniques for High-Speed Interconnects written by Rohit Sharma. This book was released on 2012-02-17. Available in PDF, EPUB and Kindle. Book excerpt: Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.

High-Speed Photonics Interconnects

2017-12-19 Computers
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Release : 2017-12-19
Genre : Computers
Kind : eBook
Book Rating : 046/5 ( reviews)

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Book Synopsis High-Speed Photonics Interconnects by : Lukas Chrostowski

Download or read book High-Speed Photonics Interconnects written by Lukas Chrostowski. This book was released on 2017-12-19. Available in PDF, EPUB and Kindle. Book excerpt: Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects. From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology. Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.

Design of 3D Integrated Circuits and Systems

2018-09-03 Technology & Engineering
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Release : 2018-09-03
Genre : Technology & Engineering
Kind : eBook
Book Rating : 426/5 ( reviews)

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Book Synopsis Design of 3D Integrated Circuits and Systems by : Rohit Sharma

Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma. This book was released on 2018-09-03. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Compact Models and Performance Investigations for Subthreshold Interconnects

2014-11-07 Technology & Engineering
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Release : 2014-11-07
Genre : Technology & Engineering
Kind : eBook
Book Rating : 32X/5 ( reviews)

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Book Synopsis Compact Models and Performance Investigations for Subthreshold Interconnects by : Rohit Dhiman

Download or read book Compact Models and Performance Investigations for Subthreshold Interconnects written by Rohit Dhiman. This book was released on 2014-11-07. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.

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