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Chiplet Design and Heterogeneous Integration Packaging

2023-03-27 Technology & Engineering
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Release : 2023-03-27
Genre : Technology & Engineering
Kind : eBook
Book Rating : 171/5 ( reviews)

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Book Synopsis Chiplet Design and Heterogeneous Integration Packaging by : John H. Lau

Download or read book Chiplet Design and Heterogeneous Integration Packaging written by John H. Lau. This book was released on 2023-03-27. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Semiconductor Advanced Packaging

2021-05-17 Technology & Engineering
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Release : 2021-05-17
Genre : Technology & Engineering
Kind : eBook
Book Rating : 761/5 ( reviews)

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Book Synopsis Semiconductor Advanced Packaging by : John H. Lau

Download or read book Semiconductor Advanced Packaging written by John H. Lau. This book was released on 2021-05-17. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

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Kind : eBook
Book Rating : 407/5 ( reviews)

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Book Synopsis Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by : John H. Lau

Download or read book Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology written by John H. Lau. This book was released on . Available in PDF, EPUB and Kindle. Book excerpt:

Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

2018-03-12 Technology & Engineering
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Release : 2018-03-12
Genre : Technology & Engineering
Kind : eBook
Book Rating : 695/5 ( reviews)

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Book Synopsis Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach by : Farhang Yazdani

Download or read book Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach written by Farhang Yazdani. This book was released on 2018-03-12. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.

Heterogeneous Integrations

2019-04-03 Technology & Engineering
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Release : 2019-04-03
Genre : Technology & Engineering
Kind : eBook
Book Rating : 241/5 ( reviews)

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Book Synopsis Heterogeneous Integrations by : John H. Lau

Download or read book Heterogeneous Integrations written by John H. Lau. This book was released on 2019-04-03. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

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