Share

3D IC Integration and Packaging

2015-07-06 Technology & Engineering
Download 3D IC Integration and Packaging PDF Online Free

Author :
Release : 2015-07-06
Genre : Technology & Engineering
Kind : eBook
Book Rating : 07X/5 ( reviews)

GET EBOOK


Book Synopsis 3D IC Integration and Packaging by : John H. Lau

Download or read book 3D IC Integration and Packaging written by John H. Lau. This book was released on 2015-07-06. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.3D IC Integration and Packaging covers:• 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP

Design And Modeling For 3d Ics And Interposers

2013-11-05 Technology & Engineering
Download Design And Modeling For 3d Ics And Interposers PDF Online Free

Author :
Release : 2013-11-05
Genre : Technology & Engineering
Kind : eBook
Book Rating : 616/5 ( reviews)

GET EBOOK


Book Synopsis Design And Modeling For 3d Ics And Interposers by : Madhavan Swaminathan

Download or read book Design And Modeling For 3d Ics And Interposers written by Madhavan Swaminathan. This book was released on 2013-11-05. Available in PDF, EPUB and Kindle. Book excerpt: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

3D Integration for VLSI Systems

2016-04-19 Science
Download 3D Integration for VLSI Systems PDF Online Free

Author :
Release : 2016-04-19
Genre : Science
Kind : eBook
Book Rating : 828/5 ( reviews)

GET EBOOK


Book Synopsis 3D Integration for VLSI Systems by : Chuan Seng Tan

Download or read book 3D Integration for VLSI Systems written by Chuan Seng Tan. This book was released on 2016-04-19. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Handbook of 3D Integration, Volume 1

2011-09-22 Technology & Engineering
Download Handbook of 3D Integration, Volume 1 PDF Online Free

Author :
Release : 2011-09-22
Genre : Technology & Engineering
Kind : eBook
Book Rating : 06X/5 ( reviews)

GET EBOOK


Book Synopsis Handbook of 3D Integration, Volume 1 by : Philip Garrou

Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou. This book was released on 2011-09-22. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

Semiconductor Advanced Packaging

2021-05-17 Technology & Engineering
Download Semiconductor Advanced Packaging PDF Online Free

Author :
Release : 2021-05-17
Genre : Technology & Engineering
Kind : eBook
Book Rating : 761/5 ( reviews)

GET EBOOK


Book Synopsis Semiconductor Advanced Packaging by : John H. Lau

Download or read book Semiconductor Advanced Packaging written by John H. Lau. This book was released on 2021-05-17. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

You may also like...