Author : Rao R. Tummala (Ingénieur électronicien)
Release : 1996
Genre :
Kind : eBook
Book Rating : /5 ( reviews)
Book Synopsis 2nd International Symposium on Advanced Packaging Materials: Processing, Properties, and Interfaces by : Rao R. Tummala (Ingénieur électronicien)
Download or read book 2nd International Symposium on Advanced Packaging Materials: Processing, Properties, and Interfaces written by Rao R. Tummala (Ingénieur électronicien). This book was released on 1996. Available in PDF, EPUB and Kindle. Book excerpt: